HPM10_16 Datasheet, PDF (18/18 Pages) ON Semiconductor – Power Management IC for Hearing Aids

Table 8. MISC DIE SPECIFICATION
Subject
Bump metallization
Backside coating specification
Backside coating thickness
HPM10
Specification
Lead Free (Sn/Ag/Cu)
Adwill LC2850
40 mm ± 3 mm
LQFP 32 Pin List
The HPM10 version used on development boards is packaged in a LQFP package of 32 pins. The following table shows the
allocation of the IOs:
Table 9. LQFP PIN LIST
Pin #
Pin Name
1
SDA
2
RESERVED
3
CCIF
4
−−
5
ATST_EN
6
VSS
7
−−
8
RESERVED
9
VDDP
10
DVREG
11
WARN
12
AGZN_REG_EN
13
SWIN
14
DS_EN
15
SWOUT
16
−−
I/O
I/O
I
I/O
I
Gnd
I/O
Power
O
O
I
I
I
O
Pin #
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Pin Name
CP1A
CP1B
VBAT
CP2A
CP2B
VSSCP
VHA
VSSA
EXT_CLK
CLKDIV[0]
CLKDIV[1]
CLKDIV[2]
VDD_OTP
VDDIO
RESERVED
SCL
I/O
O
O
Power
O
O
Gnd
O
Gnd
I
I
I
I
Power
Power
I/O
I/O
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HPM10/D
18