HPM10_16 Datasheet, PDF (17/18 Pages) ON Semiconductor – Power Management IC for Hearing Aids

HPM10
PACKAGE DIMENSIONS
WLCSP29 2.05x1.74
CASE 567MK
ISSUE O
E
ÈÈÈ _{PIN A1}
ÈÈÈÈÈÈ ^REFERENCE
2X
0.10 C
2X
0.10 C
0.10 C
TOP VIEW
DETAIL A
0.08 C
NOTE 3
A1
SIDE VIEW
E2
e1
e
F
E
D
C
B
A
1 2345
BOTTOM VIEW
AB
D
BACKSIDE
COATING
A2
DETAIL A
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF SOLDER BALLS.
4. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF SOLDER BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN MAX
A
−−− 0.46
A1 0.09 0.15
A2
0.29 REF
b 0.12 0.18
D
2.05 BSC
D2 0.185 BSC
E
1.74 BSC
E2
0.27 BSC
e
0.30 BSC
e1
0.40 BSC
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
0.40
PITCH
0.30
PITCH
A1
0.30
PITCH
e
PACKAGE
OUTLINE
29X
0.12
D2
29X b
0.05 C A B
0.03 C
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Table 7. HPM10 Pin Arrangement
1
A
SDA
B
SCL
C
D
EXT_CLK
E
VSSA
F
VHA
2
RESERVED
RESERVED
VDD_OTP
SWOUT
CLKDIV[0]
VSSCP
3
VDDIO
DS_EN
CLKDIV[2]
CLKDIV[1]
CP2B
CP2A
4
CCIF
VSS
ATST_EN
RESERVED
SWIN
VBAT
5
VDDP
DVREG
WARN
AGZN_REG_EN
CP1B
CP1A
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