CAT25128LI-G Datasheet, PDF (19/20 Pages) ON Semiconductor – 128-Kb SPI Serial CMOS EEPROM

CAT25128
Table 15. ORDERING INFORMATION (Notes 15 − 18)
Device Order Number
Specific
Device
Marking*
Package
Type
Temperature Range
Lead Finish Shipping (Note 20)
CAT25128LI−G
25128E
PDIP−8
I = Industrial
(−40°C to +85°C)
NiPdAu
Tube, 50 Units / Tube
CAT25128YI−G
S28E
TSSOP−8
I = Industrial
(−40°C to +85°C)
NiPdAu
Tube, 100 Units / Tube
CAT25128YI−GT3
S28E
TSSOP−8
I = Industrial
(−40°C to +85°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT25128YE−G
S28E
TSSOP−8
E = Extended
(−40°C to +125°C)
NiPdAu
Tube, 100 Units / Tube
CAT25128YE−GT3
S28E
TSSOP−8
E = Extended
(−40°C to +125°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT25128HU4I−GT3
S7U
UDFN−8
I = Industrial
(−40°C to +85°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT25128HU4E−GT3
S7U
UDFN−8
E = Extended
(−40°C to +125°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT25128VI−G
25128E
SOIC−8,
JEDEC
I = Industrial
(−40°C to +85°C)
NiPdAu
Tube, 100 Units / Tube
CAT25128VI−GT3
25128E
SOIC−8,
JEDEC
I = Industrial
(−40°C to +85°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT25128VE−G
25128E
SOIC−8,
JEDEC
E = Extended
(−40°C to +125°C)
NiPdAu
Tube, 100 Units / Tube
CAT25128VE−GT3
25128E
SOIC−8,
JEDEC
E = Extended
(−40°C to +125°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT25128VP2I−GT3
S7T
(Note 19)
TDFN−8
I = Industrial
(−40°C to +85°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT25128VP2E−GT3
S7T
(Note 19)
TDFN−8
E = Extended
(−40°C to +125°C)
NiPdAu
Tape & Reel,
3,000 Units / Reel
CAT25128XI−T2
25128E
SOIC−8,
JEDEC
I = Industrial
(−40°C to +85°C)
Matte−Tin
Tape & Reel,
2,000 Units / Reel
CAT25128XE−T2
25128E
SOIC−8,
JEDEC
E = Extended
(−40°C to +125°C)
Matte−Tin
Tape & Reel,
2,000 Units / Reel
15. All packages are RoHS−compliant (Lead-free, Halogen-free).
16. The standard lead finish is NiPdAu.
17. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office.
18. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device
Nomenclature document, TND310/D, available at www.onsemi.com
19. The TDFN 2x3 (VP2) package is not recommended for new design. Please replace with UDFN 2x3 (HU4).
20. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
* Marking for New Product (Rev E)
http://onsemi.com
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