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MJH11017_16 Datasheet, PDF (1/8 Pages) ON Semiconductor – Complementary Darlington Silicon Power Transistors
MJH11017, MJH11019,
MJH11021 (PNP)
MJH11018, MJH11020,
MJH11022 (NPN)
Complementary Darlington
Silicon Power Transistors
These devices are designed for use as general purpose amplifiers,
low frequency switching and motor control applications.
Features
• High DC Current Gain @ 10 Adc — hFE = 400 Min (All Types)
• Collector−Emitter Sustaining Voltage
VCEO(sus) = 150 Vdc (Min) — MJH11018, 17
= 200 Vdc (Min) — MJH11020, 19
= 250 Vdc (Min) — MJH11022, 21
• Low Collector−Emitter Saturation Voltage
VCE(sat) = 1.2 V (Typ) @ IC = 5.0 A
= 1.8 V (Typ) @ IC = 10 A
• Monolithic Construction
• These are Pb−Free Devices
MAXIMUM RATINGS
Rating
Symbol Max Unit
Collector−Emitter Voltage
VCEO
Vdc
MJH11018, MJH11017
150
MJH11020, MJH11019
200
MJH11022, MJH11021
250
Collector−Base Voltage
VCB
MJH11018, MJH11017
MJH11020, MJH11019
MJH11022, MJH11021
Vdc
150
200
250
Emitter−Base Voltage
Collector Current − Continuous
− Peak (Note 1)
VEB
5.0
Vdc
IC
15
Adc
30
Base Current
Total Device Dissipation @ TC = 25_C
Derate above 25_C
IB
0.5
Adc
PD
150
W
1.2 W/_C
Operating and Storage Junction Temperature TJ, Tstg – 65 to _C
Range
+ 150
THERMAL CHARACTERISTICS
Characteristic
Symbol Max Unit
Thermal Resistance, Junction−to−Case
RqJC
0.83 _C/W
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Pulse Test: Pulse Width = 5.0 ms, Duty Cycle v 10%.
www.onsemi.com
15 AMPERE DARLINGTON
COMPLEMENTARY SILICON
POWER TRANSISTORS
150−250 VOLTS, 150 WATTS
NPN
COLLECTOR 2
PNP
COLLECTOR 2
BASE
1
BASE
1
EMITTER 3
MJH11018
MJH11020
MJH11022
EMITTER 3
MJH11017
MJH11019
MJH11021
1
2
3
SOT−93
(TO−218)
CASE 340D
STYLE 1
TO−247
CASE 340L
STYLE 3
NOTE: Effective June 2012 this device will
be available only in the TO−247
package. Reference FPCN# 16827.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
1
August, 2016 − Rev. 10
Publication Order Number:
MJH11017/D