G3VM-6 Datasheet, PDF (4/6 Pages) Omron Electronics LLC – Technical Information

■ Solder Mounting
Perform solder mounting under the following recommended conditions
to prevent the temperature of the relays from rising, causing possible
damage to the relays.
Flow Soldering
Through Hole Packages (Once only)
Solder type
Preheating
Temperature
Lead solder
(SnPb)
150°C,
60 to 120s
Lead-free solder 150°C,
(SnAgCu)
60 to 120s
Solder
Temperature
260°C,
10s max.
260°C,
10s max.
Note: It is recommended that the suitability of solder mounting be
verified under actual conditions
Reflow Soldering
Surface Mount Packages (Twice max.)
Solder type
Preheating
Temperature*
Lead solder
(SnPb)
140 to 160°C,
60 to 120s
Lead-free solder 180 to 190°C,
(SnAgCu)
60 to 120s
Soldering
Temperature*
210°C,
30s max.
Peak,
240°C max.
230°C,
30 to 50s
Peak,
260°C max.
*Measured from the top surface of the relay package
Note: 1. It is recommended that the suitability of solder mounting be
verified under actual conditions
2. Tape cut SSOP’s are packaged without humidity resistance.
Use manual soldering to mount them.
Manual Soldering (Once only)
Manually solder at 350°C for 3s or less or at 260°C for 10s or less.
SSOP Handling Precautions
Humidity-resistant Packaging
Component cases can crack if surface-mounted components that
have absorbed moisture are subjected to thermal stress when
mounting. To prevent this, observe the following precautions.
1. Unopened components can be stored in the packaging at
5 to 30°C and a humidity of 90% max. However, they should
be used within 12 months.
2. After the packaging has been opened, components can be
stored at 5 to 30°C and a humidity of 70% max. However, they
should be mounted within 168 hours.
3. If, after opening the packaging, the humidity indicator turns
pink to the 30% mark or the expiration date is exceeded, then
bake the components while they are still on the taping reel
and use them within 72 hours. Do not bake the same compo-
nents more than once.
Baking conditions: 60 ± 5°C, 64 to 72 hours
4. If the same components are baked repeatedly, then the tape
detachment strength will change, causing potential problems
when mounting. Use caution when mounting under these
conditions.
5. When mounting using dehumidifying measures, always take
countermeasures against component damage from static
electricity.
6. Do not throw or drop the components. If the laminated pack-
aging material is damaged, airtightness will be lost.
7. Tape cut SSOP’s are packaged without humidity resistance.
Use manual soldering to mount them.
4
MOS FET Relays Technical Information