G3VM-6 Datasheet, PDF (3/6 Pages) Omron Electronics LLC – Technical Information

■ Protection from Spike Voltage on the
Output Terminals
If a spike voltage exceeding the absolute maximum rated value is
generated between the output terminals, insert a C-R snubber or
clamping diode in parallel to the load as shown in the following circuit
diagram to limit the spike voltage.
Spike Voltage Protection Circuit Example
■ Unused Terminals (6-pin models only)
Terminal 3 is connected to the internal circuit. Do not connect any-
thing to terminal 3 externally.
■ Pin Strength for Automatic Mounting
In order to maintain the characteristics of the relay, the force imposed
on any pin of the relay for automatic mounting must not exceed the
following.
■ Load Connection
Do not short-circuit the input and output terminals while the relay is
operating or the relay may malfunction.
AC Connection
+
1
−
2
3
6 _Load
5
4
Or:
AC
Or:
+
−
DC
DC
−
+
DC Single Connection
+
1
−
2
3
+
1
−
2
3
6
Load
+
5
DC
−
4
6
5
−
4
Load
DC
+
DC Parallel Connection
+
1
6
−
2
5
3
4
Load
+
DC
−
In direction A: 1.96 N
In direction B: 1.96 N
Guidelines for Mounting Devices on PCBs
■ Cleaning
When ions in the flux enter into the product during soldering, fluctua-
tion in device performance or corrosion may occur. Be sure to wash
away any flux residue which contains Cl or Na ions.
The following types of solvents are recommended for cleaning the
flux:
• Asahi Clean AK-225AES
• Kao Cleanthru 750H
• Pine-Alpha ST-100S
Cleaning Conditions
Cleaning conditions and precautions may vary according to product
specifications.
General precautions for dip cleaning
Dipping time varies according to the solvent used.
However, as a general guideline, it is recommended that the dip
time be limited to three minutes.
General precautions for ultrasonic cleaning
When ultrasonic cleaning is conducted for an excessively long
time, contact between the product resin and the metal leads may
lessen. Also, excessive ultrasonic stress may cause cracks in the
pellet.
It is recommended that the applied stress be minimized.
Recommended conditions for standard ultrasonic cleaning
Frequency:
27kHz to 29kHz
Output:
Time:
0.25 W/cm² or less
30 seconds or less
Temperature: 50°C (may vary according to the type of solvent used)
Cleaning must be conducted with the printed circuit board or device
floating on the solvent, so as to avoid direct contact between the PCB
or device and the ultrasonic vibrator.
Handling Precautions
Do not touch the device’s mark-bearing surface with your hand or
with a brush while cleaning or applying cleaning liquid to the device.
This may erase device markings. It is important to confirm that nei-
ther the solvent used for cleaning nor the cleaning conditions will
damage the device package.
MOS FET Relays Technical Information
3