MKL82Z128VLK7 Datasheet, PDF (86/133 Pages) NXP Semiconductors – 72 MHz ARM® Cortex®-M0+ with 128 KB Flash and 96 KB SRAM

Electrical characteristics
Board type Symbol
—
R_{θJB_CSB}
Descriptio
n
outside
center
(natural
convection)
121
MAPBGA
Thermal
14.6
characterizati
on
parameter,
junction to
package top
outside
center
(natural
convection)
80 LQFP
—
64
Unit
MAPBGA
19.5
°C/W
Notes
5
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
5. Thermal resistance between the die and the central solder balls on the bottom of the package based on simulation.
5.4 Peripheral operating requirements and behaviors
5.4.1 Core modules
5.4.1.1 Debug trace timing specifications
Table 52. Debug trace operating behaviors
Symbol
T_cyc
T_wl
T_wh
T_r
T_f
T_s
T_h
Description
Clock period
Low pulse width
High pulse width
Clock and data rise time
Clock and data fall time
Data setup
Data hold
Min.
Max.
Frequency dependent
2
—
2
—
—
3
—
3
1.5
—
1.0
—
Unit
MHz
ns
ns
ns
ns
ns
ns
86
NXP Semiconductors
Kinetis KL82 Microcontroller, Rev. 3, 08/2016