74HC11 Datasheet, PDF (8/15 Pages) NXP Semiconductors – Triple 3-input AND gate

NXP Semiconductors
12. Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
74HC11; 74HCT11
Triple 3-input AND gate
SOT27-1
D
L
Z
e
b
14
pin 1 index
A_{2 A}
A₁
wM
b₁
8
M_E
c
(e ₁)
M_H
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm
4.2
0.51
3.2
1.73
1.13
0.53
0.38
0.36 19.50 6.48
0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2.2
inches
0.17
0.02
0.13
0.068 0.021 0.014
0.044 0.015 0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT27-1
IEC
050G04
REFERENCES
JEDEC
JEITA
MO-001
SC-501-14
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 8. Package outline SOT27-1 (DIP14)
74HC_HCT11_4
Product data sheet
Rev. 04 — 25 March 2010
© NXP B.V. 2010. All rights reserved.
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