74HC11 Datasheet, PDF (11/15 Pages) NXP Semiconductors – Triple 3-input AND gate

NXP Semiconductors
74HC11; 74HCT11
Triple 3-input AND gate
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
c
y
Z
14
8
E
A
X
H_E
vM A
pin 1 index
1
e
7
b_p
wM
A₂
A₁
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽²⁾
e
H_E
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT402-1
MO-153
L
L_p
Q
v
w
y
Z ⁽¹⁾ θ
1
0.75 0.4
0.50 0.3
0.2 0.13
0.1
0.72
0.38
8^o
0^o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 11. Package outline SOT402-1 (TSSOP14)
74HC_HCT11_4
Product data sheet
Rev. 04 — 25 March 2010
© NXP B.V. 2010. All rights reserved.
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