DAC1408D650 Datasheet, PDF (79/88 Pages) NXP Semiconductors – Dual 14-bit DAC, up to 650 Msps, 2´ and 4´ interpolating with JESD204A interface

NXP Semiconductors
11. Package outline
DAC1408D650
Dual 14-bit DAC, up to 650 Msps, 2× and 4× interpolating
HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads;
body 14 x 14 x 1 mm; exposed die pad
SOT638-1
y
exposed die pad side
Dh
75
76
c
X
A
51
50 ZE
Eh
100
1
pin 1 index
e
E HE
wM
bp
26
25
e
bp
wM
ZD
D
HD
vM A
B
vM B
A ^A2 A1
detail X
(A3)
θ
Lp
L
0
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT _max. A1 A2 A3 bp
c D⁽¹⁾ Dh E⁽¹⁾ Eh
mm
1.2
0.15
0.05
1.05
0.95
0.25
0.27
0.17
0.20
0.09
14.1
13.9
7.1 14.1
6.1 13.9
7.1
6.1
e HD HE L
0.5
16.15 16.15
15.85 15.85
1
Lp
v
w
y ZD⁽¹⁾ ZE⁽¹⁾ θ
0.75
0.45
0.2
0.08
0.08
1.15
0.85
1.15
0.85
7°
0°
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT638-1
REFERENCES
JEDEC
JEITA
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
03-04-07
05-02-02
Fig 22. Package outline SOT638 (HTQFP100)
DAC1408D650_1
Objective data sheet
Rev. 01 — 26 May 2009
© NXP B.V. 2009. All rights reserved.
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