PRTR5V0U1T Datasheet, PDF (6/11 Pages) NXP Semiconductors – Ultra low capacitance single rail-to-rail ESD protection

NXP Semiconductors
PRTR5V0U1T
Ultra low capacitance single rail-to-rail ESD protection
7. Application information
With a capacitance of only 1 pF, the PRTR5V0U1T offers IEC 61000-4-2, level 4
compliant ESD protection.
The PRTR5V0U1T integrates one ultra low capacitance rail-to-rail ESD protection
channel and an additional ESD protection diode.
The additional ESD protection diode connected between ground and V_CC prevents
charging of the supply.
To achieve the maximum ESD protection level, no additional external capacitors are
required.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the PRTR5V0U1T as close to the input terminal or connector as possible.
2. The path length between the PRTR5V0U1T and the protected line should be
minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
PRTR5V0U1T_1
Product data sheet
Rev. 01 — 25 September 2008
© NXP B.V. 2008. All rights reserved.
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