N0118GA Datasheet, PDF (5/13 Pages) NXP Semiconductors – SCR

NXP Semiconductors
5. Thermal characteristics
Table 5.
Symbol
R_th(j-lead)
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from junction
to lead
thermal resistance from junction
to ambient
Conditions
see Figure 6
printed circuit board mounted:
lead length = 4 mm
10²
Z_th(j-lead)
(K/W)
10
N0118GA
SCR
Min Typ Max Unit
-
-
60 K/W
-
150 -
K/W
001aab451
1
10^−1
P
t_p
δ=
T
10^−2
10^−5
10^−4
10^−3
10^−2
10^−1
t_p
t
T
1
10
t_p (s)
Fig 6. Transient thermal impedance from junction to lead as a function of pulse width
N0118GA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 11 July 2011
© NXP B.V. 2011. All rights reserved.
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