TDA8263HN Datasheet, PDF (28/28 Pages) NXP Semiconductors – Fully integrated satellite tuner

Philips Semiconductors
TDA8263HN
Fully integrated satellite tuner
26. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1 25
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5
Typical performances . . . . . . . . . . . . . . . . . . . . 3
6
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
7
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
8.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
9
Tuner configuration . . . . . . . . . . . . . . . . . . . . . . 6
10
Functional description . . . . . . . . . . . . . . . . . . . 6
10.1
Gain distribution . . . . . . . . . . . . . . . . . . . . . . . . 7
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
I²C-bus inputs . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Address selection . . . . . . . . . . . . . . . . . . . . . . . 8
Master-slave selection . . . . . . . . . . . . . . . . . . . 8
Data transfer in write mode. . . . . . . . . . . . . . . . 8
I²C-bus table in write mode. . . . . . . . . . . . . . . . 8
I²C-bus table in write mode (default at POR) . . 9
Bit description I²C-bus write mode . . . . . . . . . . 9
Data transfer in read mode . . . . . . . . . . . . . . . 14
I²C-bus table in read mode . . . . . . . . . . . . . . . 14
Bit description I²C-bus read mode . . . . . . . . . 14
12
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 16
13
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 19
14
Thermal characteristics. . . . . . . . . . . . . . . . . . 19
15
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 19
16
Application information. . . . . . . . . . . . . . . . . . 22
17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
18
Handling information. . . . . . . . . . . . . . . . . . . . 24
19
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
19.1
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
19.2
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24
19.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 24
19.4
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 25
19.5
Package related soldering information . . . . . . 25
20
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 27
22
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
23
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
24
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Contact information . . . . . . . . . . . . . . . . . . . . 27
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 14 December 2004
Document number: 9397 750 13193
Published in The Netherlands