TDA8034T Datasheet, PDF (23/29 Pages) NXP Semiconductors – Smart card interface

NXP Semiconductors
TDA8034T; TDA8034AT
Smart card interface
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 16. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
Table 12. Abbreviations
Acronym
Description
EMV
Europay MasterCard VISA
ESD
ElectroStatic Discharge
ESR
Equivalent Series Resistor
FCDM
Field Charged Device Model
HBM
Human Body Model
LDO
Low Drop-Out
MM
Machine Model
NMOS
Negative-channel Metal-Oxide Semiconductor
POR
Power-On Reset
TDA8034T_TDA8034AT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2.0. — 12 November 2010
© NXP B.V. 2010. All rights reserved.
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