TDA8034T Datasheet, PDF (13/29 Pages) NXP Semiconductors – Smart card interface

NXP Semiconductors
TDA8034T; TDA8034AT
Smart card interface
CMDVCCN
t0
3 V or 5 V
V_CC
t1
t2
3V
001aal000
Fig 12. Card activation, V_CC = 3 V, t0 > 15 ms
If pin CMDVCCN is HIGH for more than 30 ms (card inactive), and if the card needs to be
activated at 3 V, the sequence shown in Figure 12 applies: pin CMDVCCN must be set
LOW for t1 (200 μs < t1 < 700 μs), and then HIGH for t2 (200 μs < t2 < 15 ms) before
going LOW.
9. Limiting values
Remark: All card contacts are protected against any short-circuit to any other card
contact. Stress beyond the levels indicated in Table 5 can cause permanent damage to
the device. This is a short-term stress rating only and under no circumstances implies
functional operation under long-term stress conditions.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
V_DDP
V_DD
V_DD(INTF)
V_I
power supply voltage
supply voltage
interface supply voltage
input voltage
pin V_DDP
pin V_DD
pin V_DD(INTF)
pins CMDVCCN, CLKDIV1, RSTIN, OFFN,
XTAL1, XTAL2, I/OUC
card contact pins PRESN, I/O, RST and
CLK
T_stg
P_tot
T_j
T_amb
V_ESD
storage temperature
total power dissipation
junction temperature
ambient temperature
electrostatic discharge voltage
T_amb = −25 °C to +85 °C
Human Body Model (HBM) on card pins I/O,
RST, V_CC, CLK, PRESN; within typical
application
Human Body Model (HBM); all other pins
Machine Model (MM); all pins
Field Charged Device Model (FCDM);
all pins
Min Max Unit
−0.3 +6
V
−0.3 +4.6 V
−0.3 +4.6 V
−0.3 +4.6 V
−0.3 +6
V
−55 +150 °C
-
0.25 W
-
+125 °C
−25 +85 °C
−6
+6
kV
−2
+2
kV
−200 +200 V
−500 +500 V
10. Thermal characteristics
Table 6.
Symbol
R_th(j-a)
Thermal characteristics
Package name Parameter
SO16
thermal resistance from junction to ambient
Conditions
in free air
Typ
Unit
94
K/W
TDA8034T_TDA8034AT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2.0. — 12 November 2010
© NXP B.V. 2010. All rights reserved.
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