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TDA8024 Datasheet, PDF (17/29 Pages) NXP Semiconductors – IC card interface
Philips Semiconductors
IC card interface
Product specification
TDA8024
12 CHARACTERISTICS
VDD = 3.3 V; VDDP = 5 V; Tamb = 25 °C; fXTAL = 10 MHz; all currents flowing into the IC are positive; see note 1; unless
otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP
MAX. UNIT
Temperature
Tamb
ambient temperature
Supplies
VDD
VDDP
IDD
IDDP
Vth2
Vhys2
supply voltage
DC/DC converter supply
voltage
supply current
VCC = 5 V; ICC < 80 mA
VCC = 5 V; ICC < 20 mA
card inactive
DC/DC converter supply
current
falling threshold voltage on
VDD
hysteresis of threshold
voltage Vth2
card active; fCLK = fXTAL;
CL = 30 pF
inactive mode
active mode; fCLK = fXTAL;
CL = 30 pF; ICC = 0
VCC = 5 V; ICC = 80 mA
VCC = 3 V; ICC = 65 mA
no external resistors at
pin PORADJ; VDD level falling
no external resistors at
pin PORADJ
Pin PORADJ; note 2
Vth(ext)(rise)
Vth(ext)(fall)
Vhys(ext)
∆Vhys(ext)
external rising threshold
voltage on VDD
external falling threshold
voltage on VDD
hysteresis of threshold
voltage Vth(ext)
hysteresis of threshold
voltage Vth(ext) variation
with temperature
external resistor bridge at
pin PORADJ; VDD level rising
external resistor bridge at
pin PORADJ; VDD level falling
external resistor bridge at
pin PORADJ
external resistor bridge at
pin PORADJ
tw
width of internal Power-on no external resistors at
reset pulse
pin PORADJ
external resistor bridge at
pin PORADJ
IL(PORADJ)
Ptot
leakage current on
pin PORADJ
total power dissipation
VPORADJ < 0.5 V
VPORADJ > 1 V
continuous operation;
Tamb = −25 to +85 °C
−25
2.7
4.0
3.0
−
−
−
−
−
−
2.35
50
1.240
1.190
30
−
4
8
−0.1
−1
−
−
+85
°C
−
6.5
V
5.0
6.5
V
−
6.5
V
−
1.2
mA
−
1.5
mA
−
0.1
mA
−
10
mA
−
200
mA
−
100
mA
2.45
2.55
V
100
150
mV
1.28
1.310 V
1.22
1.26
V
60
90
mV
−
0.25
mV/K
8
12
ms
16
24
ms
4
10
µA
−
+1
µA
−
0.56
W
2004 July 12
17