PDTA114EU.115 Datasheet, PDF (11/17 Pages) NXP Semiconductors – PNP Resistor-Equipped Transistor (RET) family in small Surface-Mounted Device (SMD) plastic packages.

NXP Semiconductors
11. Soldering
PDTA114E series
PNP resistor-equipped transistors; R1 = 10 k, R2 = 10 k
2.2
1.7
solder lands
solder resist
0.85
12
solder paste
0.5
(3×)
occupied area
0.6
(3×)
1.3
Dimensions in mm
sot416_fr
Reflow soldering is the only recommended soldering method.
Fig 16. Reflow soldering footprint PDTA114EE (SOT416/SC-75)
1.3
0.7
R0.05 (12×)
solder lands
0.9
0.25
(2×)
0.3
(2×)
0.4
(2×)
0.6 0.7
0.3
0.4
solder resist
solder paste
occupied area
Dimensions in mm
sot883_fr
Reflow soldering is the only recommended soldering method.
Fig 17. Reflow soldering footprint PDTA114EM (SOT883/SC-101)
PDTA114E_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 21 December 2011
© NXP B.V. 2011. All rights reserved.
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