BCP69 Datasheet, PDF (10/13 Pages) NXP Semiconductors – PNP medium power transistor

NXP Semiconductors
10. Soldering
BCP69
20 V, 1 A PNP medium power transistor
1.3 1.2
(4×) (4×)
7
3.85
3.6
3.5
0.3
4
3.9 6.1 7.65
1
2
3
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
2.3
2.3
1.2
(3×)
1.3
(3×)
6.15
Fig 12. Reflow soldering footprint SOT223 (SC-73)
8.9
6.7
BCP69_6
Product data sheet
1.9
4
6.2
8.7
1
2
3
1.9
(3×)
2.7
2.7
1.1
1.9
(2×)
Fig 13. Wave soldering footprint SOT223 (SC-73)
Rev. 06 — 2 December 2008
sot223_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot223_fw
© NXP B.V. 2008. All rights reserved.
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