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LMC6681 Datasheet, PDF (9/24 Pages) National Semiconductor (TI) – Low Voltage, Rail-To-Rail Input and Output CMOS
AC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 3V, V− = 0V, VCM = VO = V+/2, VPD = 0.6V and RL > 1
MΩ. Boldface limits apply at the temperature extremes (Note 16).
LMC6681AI LMC6681BI
Symbol
Parameter
Conditions
Typ
(Note 5)
LMC6682AI
LMC6684AI
Limit
LMC6682BI
LMC6684BI
Limit
Units
(Note 6)
(Note 6)
tON
Time Delay for
Device to Power ON
(Note 15)
50
200
200
µs
tOFF
Time Delay for
Device to Power OFF
(Note 15)
0.5
2
2
µs
SR
Slew Rate
(Note 8)
1.2
0.7
0.7
V+ = 10V, (Note 10)
0.55
1.2
0.7
0.55
V/µs
0.7
min
0.55
0.55
GBW
Gain-Bandwidth Product
1.2
MHz
φm
Phase Margin
50
Deg
Gm
Gain Margin
12
dB
Amp-to-Amp Isolation
V+ = 10V (Note 9)
130
dB
en
Input-Referred
f = 1 kHz
32
Voltage Noise
VCM = 0.5V
in
Input-Referred
f = 1 kHz
0.5
Current Noise
T.H.D.
Total Harmonic Distortion
f = 1 kHz, AV = +1
0.01
%
RL = 10 kΩ, VO = 2 VPP
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device is in-
tended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the electrical characteristics.
Note 2: Human body model, 1.5 kΩ in series with 100 pF.
Note 3: Applies to both single-supply and split-supply operation. Continous short circuit operation at elevated ambient temperature can result in exceeding the maxi-
mum allowed junction temperature of 150˚C. Output current in excess of ±30 mA over long term may adversely affect reliability.
Note 4: The maximum power dissipation is a function of TJ (max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)
− TA)/θJA. All numbers apply for packages soldered directly into a PC board.
Note 5: Typical Values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: V+ = 3V, VCM = 0.5V. For sourcing and sinking, 0.5V ≤ VO ≤ 2.5V.
Note 8: V+ = 3V. Connected as Voltage Follower with 2V step input, and the output is measured from 15%–85%. Number specified is the slower of the positive or
negative slew rates.
Note 9: Input referred, V+ = 10V, and RL = 100 kΩ connected to 5V. Each amp excited in turn with 1 kHz to produce VO = 2 VPP.
Note 10: V+ = 10V. Connected as voltage follower with 8V step Input, and output is measured from 15%–85%. Number specified is the slower of the positive or nega-
tive slew rates.
Note 11: Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
Note 12: Guaranteed limits are dictated by tester limitations and not device performance. Actual performance is reflected in the typical value.
Note 13: CMRR+ and CMRR− are tested, and the number indicated is the lower of the two values. For CMRR+, V+/2 < VCM < V+ for 1.8V, 2.2V, 3V, 5V, and 10V.
For CMRR−, 0 < VCM < V+/2 for 3V, 5V and 10V. For 1.8V and 2.2V, 0.25 < VCM < V+ − 0.3.
Note 14: V+ = 10V, VCM = 0.5V. For Sourcing tests, 1V ≤ VO ≤ 5V. For Sinking tests, 5V ≤ VO ≤ 9V.
Note 15: The propogation delays are measured using an input waveform of f = 5 Hz, and magnitude of 2.4V. Refer to Section 6.3 and Figures 14, 15 for a detailed
explanation.
Note 16: The VPD (threshold low and threshold high) limits are guaranteed at room temperature and at temperature extremes. Room temperature limits are produc-
tion tested. Limits at temperature extremes are guaranteed via correlation using temperature regression analysis methods. Refer to Section 6.2 for an overview of
the threshold voltages.
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