LMH6560 Datasheet, PDF (6/23 Pages) National Semiconductor (TI) – Quad, High-Speed, Closed-Loop Buffer

3V Electrical Characteristics (Continued)
Unless otherwise specified, all limits guaranteed for T_J = 25˚C, V⁺ = 3V, V^− = 0V, V_O = V_CM = V⁺/2 and R_L = 100Ω to V⁺/2.
Boldface limits apply at the temperature extremes.
Symbol
Parameter
V_O
Output Swing Positive
Output Swing Negative
I_SC
Output Short Circuit Current
I_O
Linear Output Current
Conditions
R_L = 100Ω to V⁺/2
R_L = 2kΩ to V⁺/2
R_L = 100Ω to V⁺/2
R_L = 2kΩ to V⁺/2
Sourcing: V_IN = V⁺; V_O = V⁺/2
Sinking: V_IN = V^−; V_O = V⁺/2
Sourcing: V_IN - V_O = 0.5V
(Note 10)
Sinking: V_IN - V_O = −0.5V
(Note 10)
Min
(Note 9)
2.0
1.93
2.1
2.0
−20
−13
12
8
Typ
(Note 8)
2.05
2.15
0.95
0.85
−26
14
−30
20
Max
(Note 9)
1.0
1.07
0.90
1.0
Units
V
V
mA
mA
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model, 1.5kΩ in series with 100pF
Note 3: Machine Model, 0Ω in series with 200pF.
Note 4: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150˚C.
Note 5: Short circuit test is a momentary test. See next note.
Note 6: The maximum power dissipation is a function of T_J(MAX), θ_JA , and T_A. The maximum allowable power dissipation at any ambient temperature is P_D =
(T_J(MAX) - T_A ) / θ_JA. All numbers apply for packages soldered directly onto a PC board.
Note 7: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T_J = T_A. There is no guarantee of parametric performance as indicated in the electrical tables under conditions of internal self-heating where
T_J > T_A. See Applications section for information on temperature de-rating of this device.
Note 8: Typical Values represent the most likely parametric norm.
Note 9: All limits are guaranteed by testing or statistical analysis.
Note 10: Positive current corresponds to current flowing into the device.
Note 11: Slew rate is the average of the positive and negative slew rate. Average Temperature Coefficient is determined by dividing the change in a parameter at
temperature extremes by the total temperature change.
Note 12: Average Temperature Coefficient is determined by dividing the change in a parameter at temperature extremes by the total temperature change.
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