LMH6559_06 Datasheet, PDF (6/22 Pages) National Semiconductor (TI) – High-Speed, Closed-Loop Buffer

3V Electrical Characteristics (Continued)
Unless otherwise specified, all limits guaranteed for T_J = 25˚C, V⁺ = 3V, V^− = 0V, V_O = V_CM = V⁺/2 and R_L = 100Ω to V⁺/2.
Boldface limits apply at the temperature extremes.
Symbol
Parameter
Conditions
Min
Typ
Max
(Note 8) (Note 7) (Note 8)
Units
I_O
Linear Output Current
Sourcing: V_IN - V_O = 0.5V
−20
−28
(Note 9)
−13
mA
Sinking: V_IN - V_O = −0.5V
12
17
(Note 9)
8
Note 1: Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150˚C.
Note 4: Short circuit test is a momentary test. See next note.
Note 5: The maximum power dissipation is a function of T_J(MAX), θ_JA, and T_A. The maximum allowable power dissipation at any ambient temperature is P_D =
(T_J(MAX) – T_A) / θ_JA. All numbers apply for packages soldered directly onto a PC board.
Note 6: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T_J = T_A. There is no guarantee of parametric performance as indicated in the electrical tables under conditions of internal self-heating where
T_J > T_A. See Applications section for information on temperature de-rating of this device.
Note 7: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 8: All limits are guaranteed by testing or statistical analysis.
Note 9: Positive current corresponds to current flowing into the device.
Note 10: Slew rate is the average of the positive and negative slew rate.
Note 11: Average Temperature Coefficient is determined by dividing the change in a parameter at temperature extremes by the total temperature change.
Connection Diagrams
8-Pin SOIC
5-Pin SOT23
Top View
Ordering Information
Package
8-Pin SOIC
5-Pin SOT23
Part Number
LMH6559MA
LMH6559MAX
LMH6559MF
LMH6559MFX
20064134
Package Marking
LMH6559MA
B05A
Top View
20064135
Transport Media
95 Units/Rail
2.5k Units Tape and Reel
1k Units Tape and Reel
3k Units Tape and Reel
NSC Drawing
M08A
MF05A
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