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LMH6628EP Datasheet, PDF (4/16 Pages) National Semiconductor (TI) – Enhanced Plastic Dual Wideband, Low Noise, Voltage Feedback Op Amp
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Symbol
Parameter
ICC
Supply Current
Miscellaneous Performance
RIN
Input Resistance
CIN
ROUT
VO
VOL
CMIR
IO
Input Capacitance
Output Resistance
Output Voltage Range
Input Voltage Range
Output Current
Conditions
Per Channel, RL = ∞
Common-Mode
Differential-Mode
Common-Mode
Differential-Mode
Closed-Loop
RL = ∞
RL = 100Ω
Common- Mode
Min
Typ
Max
Units
7.5
9
12
mA
7.0
12.5
500
kΩ
200
kΩ
1.5
pF
1.5
pF
.1
Ω
±3.8
V
±3.2
±3.5
V
±3.1
±3.7
V
±50
±85
mA
Note 4: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables.
Note 5: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating
of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self heating where TJ >
TA. See Note 6 for information on temperature de-rating of this device." Min/Max ratings are based on product characterization and simulation. Individual
parameters are tested as noted.
Note 6: Output is short circuit protected to ground, however maximum reliability is obtained if output current does not exceed 160mA.
Note 7: Human body model, 1.5kΩ in series with 100pF. Machine model, 0Ω In series with 200pF.
Note 8: The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX)-TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.
Typical Performance Characteristics (TA = +25°, AV = +2, VCC = ±5V, Rf =100Ω, RL = 100Ω, unless
specified)
Non-Inverting Frequency Response
Inverting Frequency Response
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200886 Version 4 Revision 2 Print Date/Time: 2010/10/15 15:22:20
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