LMH6550_14 Datasheet, PDF (2/25 Pages) National Semiconductor (TI) – LMH6550 Differential, High Speed Op Amp

LMH6550
SNOSAK0H – DECEMBER 2004 – REVISED MARCH 2013
Connection Diagram
1
-IN
2
V_CM
3
V+
+OUT ⁴
-+
8
+IN
7 _EN
6
V-
5
-OUT
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Figure 2. 8-Pin SOIC & VSSOP - Top View
See Package Number D0008A & DGK0008A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ⁽¹⁾⁽²⁾
ESD Tolerance ⁽³⁾
Human Body Model
Machine Model
Supply Voltage
Common Mode Input Voltage
Maximum Input Current (pins 1, 2, 7, 8)
Maximum Output Current (pins 4, 5)
Maximum Junction Temperature
Soldering Information:
See Product Folder at www.ti.com and SNOA549C
2000V
200V
13.2V
±V_S
30 mA
(4)
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the
Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model: 1.5 kΩ in series with 100 pF. Machine model: 0Ω in series with 200pF.
(4) The maximum output current (I_OUT) is determined by device power dissipation limitations.
Operating Ratings ⁽¹⁾
Operating Temperature Range
Storage Temperature Range
Total Supply Voltage
Package Thermal Resistance (θ_JA) ⁽²⁾
8-Pin SOIC
8-Pin VSSOP
−40°C to +85°C
−65°C to +150°C
4.5V to 12V
150°C/W
235°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the
Electrical Characteristics tables.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA and T_A. The maximum allowable power dissipation at any ambient
temperature is P _D= (T_J(MAX) — T_A)/ θ_JA. All numbers apply for package soldered directly into a 2 layer PC board with zero air flow.
2
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