UPD784044 Datasheet, PDF (81/90 Pages) NEC – 16-BIT SINGLE-CHIP MICROCONTROLLER

µPD784044(A), 784046(A)
15. RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the conditions recommended below.
For details of soldering conditions, refer to the information document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, please contact your NEC representa-
tive.
Table 15-1. Surface-Mount Type Soldering Conditions
µPD784044GC(A)-×××-3B9 : 80-pin plastic QFP (14 × 14 mm)
µPD784044GC(A1)-×××-3B9 : 80-pin plastic QFP (14 × 14 mm)
µPD784044GC(A2)-×××-3B9 : 80-pin plastic QFP (14 × 14 mm)
Soldering Method
Soldering Conditions
Infrared reflow
Partial heating
Package peak temperature: 235 ˚C, Time: 30 sec. max. (210 ˚C min.),
Number of times: 3 max.
Pin temterature: 300 ˚C max., 3 sec. max. (per side of device)
Recommended
Condition Symbol
IR35-00-3
–
Caution The µPD784046(A), (A1), and (A2) are under development. Therefore, the soldering conditions
for the µPD784046(A), (A1), and (A2) are undefined.
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