UPD17016 Datasheet, PDF (312/324 Pages) NEC – 4-BIT SINGLE-CHIP MICROCONTROLLERS WITH DIGITAL TUNING SYSTEM HARDWARE

µPD17016, 17017
27. RECOMMENDED SOLDERING CONDITIONS
Solder the µPD17016 and 17017 under the following recommended conditions.
For details of the recommended soldering conditions, refer to Information document Semiconductor Device
Mounting Technology Manual (C10535E).
For the soldering methods and conditions other than those recommended, consult NEC.
Table 27-1. Soldering Conditions of Surface Mount Type
µPD17016GF-xxx-3B9: 80-pin plastic QFP (14 × 20 mm)
µPD17017GF-xxx-3B9: 80-pin plastic QFP (14 × 20 mm)
Soldering Method
Soldering Condition
Symbol of
Recommended
Soldering Condition
Infrared reflow
Package peak temperature: 235 °C, Time: 30 seconds max. (210 °C min.),
Number of times: 2 max., Number of days: 7^Note (After this, prebaking at 125 °C
for 20 hours is necessary.)
<Precaution>
Products other than those supplied in heat-resistance tray (magazine, taping, and
heat-labile tray) cannot be baked in their packs.
IR35-207-2
VPS
Package peak temperature: 215 °C, Time: 40 seconds max. (200 °C min.),
Number of times: 2 max., Number of days: 7^Note (After this, prebaking at 125 °C
for 20 hours is necessary.)
<Precaution>
Products other than those supplied in heat-resistance tray (magazine, taping, and
heat-labile tray) cannot be baked in their packs.
VP15-207-2
Wave soldering
Solder bath temperature: 260 °C max., Time: 10 seconds max.,
Number of times: 1, Preheating temperature: 120 °C max. (package surface
temperature), Number of days: 7^Note (After this, prebaking at 125 °C for 20 hours
is necessary.)
WS60-207-1
Partial heating Pin temperature: 300 °C max., Time: 3 seconds max. (per side of device)
–
Note The number of days for which the device can be left at 25 °C, 65 % RH max. after the dry pack has been
opened.
Caution Do not use two or more soldering methods in combination (except the partial heating method).
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