UPD9611 Datasheet, PDF (26/28 Pages) NEC – FOUR-CHANNEL PCM CODEC

µPD9611
7. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions, refer to the information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, please contact your NEC sales
representative.
SURFACE MOUNT TYPE
µPD9611GT: 48-pin shrink SOP (375 mil)
Soldering Method
Infrared reflow
Pin heating
Soldering Conditions
Package peak temperature: 235 °C
Duration: 30 sec. max. (210 °C or above)
Number of times: 2 max.
Time limit: 3 days^Note (thereafter, 10-hour prebaking at 125 °C required.)
<Cautions>
(1) Wait for the device temperature to return to normal after the first reflow
before starting the second reflow.
(2) Do not perform flux cleaning with water after the first reflow.
Pin temperature: 300 °C max.
Duration: 3 sec. max. (per side of device)
Recommended
Condition Symbol
IR-35-103-2
—
Note For the storage period after unpacking from the dry-pack, storage conditions are max. 25 °C, 65 % RH.
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