BAT46WJ Datasheet, PDF (8/12 Pages) NXP Semiconductors – Single Schottky barrier diode

NXP Semiconductors
9. Package outline
BAT46WJ
Single Schottky barrier diode
1.35
1.15
1
2.7 1.8
2.3 1.6
0.80
0.65
0.5
0.3
Dimensions in mm
2
0.40
0.25
Fig 12. Package outline SOD323F (SC-90)
0.25
0.10
04-09-13
10. Packing information
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.^[1]
Type number Package Description
BAT46WJ
SOD323F 4 mm pitch, 8 mm tape and reel
Packing quantity
3 000
10 000
-115
-135
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
3.05
2.2
2.1
1.65 0.95
0.5 (2×) 0.6 (2×)
0.5
(2×)
0.6
(2×)
Reflow soldering is the only recommended soldering method.
Fig 13. Reflow soldering footprint SOD323F (SC-90)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sod323f_fr
BAT46WJ
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 8 November 2011
© NXP B.V. 2011. All rights reserved.
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