LSM2-T-30-D12-C Datasheet, PDF (3/12 Pages) Murata Manufacturing Co., Ltd. – DOSA-SMT, 30A POL DC/DC Converters

LSM2-T/30-D12 Series
DOSA-SMT, 30A POL DC/DC Converters
MECHANICAL SPECIFICATIONS
Case C71
TOP
VIEW
PIN #1 THIS
CORNER (FAR SIDE)
SMT contacts: copper alloy with
5μ" Au (min.) over 50μ" Ni (min.)
13.5
0.53
33.0
1.30
9.1
0.36
0.020 MIN
BETWEEN MTG PLANE
AND COMPONENTS
4 EQ SP @
0.190 [4.83] EACH
EQUALS .760 [19.30]
BOTTOM
VIEW
4.83
0.190
REF
3
4
5
6
10.92
0.430
1.27
0.050
2.90
0.114
*
2
0.69
0.027
29.90
1.177
SIDE
VIEW
ISOMETRIC
VIEW
PIN #1
1.57±0.20
.062±0.008
CONTACTS TYP
MTG PLANE
2.03±0.13
0.080±0.005
REF
8.76
0.345
7
*
1
3.05
0.120
1.91
.075
END
VIEW
ALL PINS COPLANAR
WITHIN 4 MILS
Component locations
are typical.
INPUT/OUTPUT CONNECTIONS P72
Pad
Function
1
On/Off Control
2
+Input
3
Sequence/Track In
4
Common
5
+Output
6
Trim
7
Sense In
* Additional Ground (optional)
Dimensions are in inches (mm) shown for ref. only.
Third Angle Projection
Tolerances (unless otherwise specified):
.XX ± 0.02 (0.5)
.XXX ± 0.010 (0.25)
Angles ± 2˚
Components are shown for reference only.
1.22
0.048
0.64
0.025
0
2.26
0.089 _2.41
0.095
REF
0.140 [3.56] x
0.095 [2.41]
PADS (7 PLS)
2
1
*
*
3
4
5
6
7
3.56
0.140
REF
2.41
0.095
REF
33.5
1.32
RECOMMENDED PAD LAYOUT
(VIEWED FROM TOP)
1.47
0.058
2.16
0.085
0
3.05
0.120
10.29
0.405
14.0
0.55
0.095 [2.41] x
0.082 [2.08] PADS
(2 PLS) FOR
OPTIONAL GNDS
Additional Ground/Thermal Pads (“R” models)
The LSM2-T/30-D12 is optionally available with two additional ground
pads for increased current handling and better heat transfer. These are
indicated with the “R” designator in the model number, LSM2-T/30-D12R-C.
MPS recommends that users lay out their PC boards to accept these two
pads for larger current applications. Please note that the Derating curves for
the “R” models accept higher temperature and greater current limits than
units without the additional pads.
www.murata-ps.com/support
To realize the additional current and thermal capacity of “R” models, you
must have a substantial area of several square inches of copper etch flow-
soldered to these pads and sufficient feed-throughs or other means of con-
ducting current. The “R” pads and the standard pads 1 and 2 are in parallel.
If your application uses a standard DOSA pad layout and you cannot connect
to these ground pads, order model LSM2-T/30-D12-C without the “R” designa-
tor. Please observe the lower Derating curves for standard, “non-R” models.
MDC_LSM2_T30_D12 Series.C01Δ Page 3 of 12