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PTGL09BD2R2N2B51B0 Datasheet, PDF (23/103 Pages) Murata Manufacturing Co., Ltd. – PTC Thermistors for Overcurrent Protection / for Inrush Current Suppression / for Overheat Sensing Lead Type
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
R90E.pdf
Sep.24,2012
Chip Type Specifications and Test Methods
1
c PRG18/21BC Series
No.
Item
1 Operating Temp.
2 Resistance Value (at 25°C)
3 Withstanding Voltage
-10 to 60°C
Rating Value
The resistance value should be within the specified
tolerance.
Without damage
Method of Examination
Temperature range with maximum voltage applied to PTC.
After leaving for 24 hrs. or more in 25°C, it measures by 4 wire
measuring methods using the direct-current terminal current of
10mA or less (0.1 or less Vdcs).
We apply 120% of the maximum operating voltage to PTC by
raising gradually for 180±5 secs. at 25°C. (A protective resistor
is to be connected in series, and the inrush current through
PTC must be limited below maximum rated value.)
EIAJ ET-7403 term 9
Soldered PTC to PCB and add a force of 5.0N in the direction
as shown below.
PTC
4 Adhesive Strength
There is no sign of exfoliation on electrode.
F
F
Glass Epoxy PCB
F=5.0N
5 Vibration
Normal appearance
Resistance change: not to exceed ±20% (*)
6 Solderability
Min. 75% electrode is covered with new solder.
Resistance change: not to exceed ±20% (*)
7 Soldering Heat Resistance
Normal appearance
Resistance change: not to exceed ±20% (*)
8 Dry Heat
9 Cold
10 Damp Heat
11 Temperature Cycling
Normal appearance
Resistance change: not to exceed ±20% (*)
JIS C 5102 term 8.2
Soldered PTC to PCB
Vibration: A 10-55-10Hz (1 min.)
Width: 1.5mm
Vibrate for 2 hrs. in each of 3 mutually perpendicular planes for
a total of 6 hrs.
JIS C 5102 term 8.4
Solder: Sn-3Ag-0.5Cu
Solder temp: 245±5°C
Soaking time: 3±0.5 secs.
Soaking position: Until a whole electrode is soaked.
Solder: Sn-3Ag-0.5Cu
Flax: Solder paste containing less than 0.2wt% of chlorine.
Preheating: 150±5°C 3 mins.
Peak temp.: 260±5°C 10±5 secs. (reflow)
PCB: Glass Epoxy PCB (JIS C 6484)
60±3°C leave for 1000±12 hrs.
-10±3°C leave for 1000±12 hrs.
60±2°C, 90-95%RH leave for 500±4 hrs.
JIS C 5102 term 9.3
Times: 5 cycles
Step
1
2
3
4
Temp. (°C)
-20 +0, -3
Room temp.
+85 +3, -0
Room temp.
Time (min.)
30
10-15
30
10-15
12 High Temperature Load
60±3°C (in air), PTC is applied maximum operating voltage for
1.5 hrs. on and 0.5 hrs. off. This cycle is repeated for 500±10 hrs.
(*) The resistance measurement after the test.
After leaving for 24 hours or more in 25±2°C, it measures by 4 wire measuring methods using the direct-current terminal current of 10mA or less (0.1 or
less Vdcs).
Above mentioned soldering in "4. Adhesive Strength" and "5. Vibration" is done under the following conditions at our site.
#Glass-Epoxy PC board
#Standard land dimension
#Standard solder paste
#Standard solder profile
Above conditions are mentioned in Notice.
21