CSTCE12M0G55Z-R0 Datasheet, PDF (14/45 Pages) Murata Manufacturing Co., Ltd. – Ceramic Resonators (CERALOCKr)

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Notice for Automotive
P16E.pdf
Nov.22,2012
c Soldering and Mounting (CSTCC/CSTCR/CSTCE_V/CSTCE_G Series)
1. Soldering
(1) Reflow soldering
Please mount component on a circuit board by reflow
soldering. Flow soldering is not acceptable.
Recommendable Flux and Solder
Please use rosin based flux,
Flux
not water soluble flux.
Please use solder (Sn-3.0Ag-0.5Cu) under
Solder
the following conditions: Standard thickness
260
245
of soldering paste: 0.10 to 0.15mm.
220
180
150
Recommendable Soldering Profile
Pre-heating
150 to 180°C
60 to 120s
Heating
220°C min.
30 to 60s
Peak Temperature
upper limit: 260°C
lower limit: 245°C
1s max.
5s max.
Temperature shall be measured on the surface of component.
(2) Soldering with Iron
If compelled to mount the component by using soldering
iron, please do not directly touch the component with the
soldering iron. The component terminals or electrical
characteristics may be damaged if excessive thermal
stress is applied.
Recommendable Soldering with Iron
Heating of the soldering iron
350°C max.
Watt
30W max.
Shape of the soldering iron
ø3mm max.
Soldering Time
5s max. at one terminal
Solder
Sn-3.0Ag-0.5Cu
Pre-heating
(150 to 180°C)
60 to 120s
Peak
Heating
(220°C min.)
Gradual
Cooling
30 to 60s
(3) Solder Volume
Please make the solder volume less than the height of
the substrate to avoid damage to the seal between the
metal cap and the substrate.
(4) Other
Do not reuse components removed from a circuit board
after soldering.
(5) Conditions for Placement Machines
The component is recommended with placement
machines that employ optical placement capabilities. The
component may be damaged by excessive mechanical
force. Please make sure that you have evaluated by
using placement machines before going into mass
production. Do not use placement machines that utilize
mechanical positioning. Please contact Murata for details
beforehand.
Continued on the following page.
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