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MC9S12B128 Datasheet, PDF (85/128 Pages) Motorola, Inc – microcontroller unit (MCU) | |||
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Device User Guide â9S12B128DGV1/D V01.11
Table A-5 Thermal Package Characteristics1
Num C
Rating
Symbol Min
Typ
1 T Thermal Resistance LQFP112, single sided PCB2
θJA
â
â
Thermal Resistance LQFP112, double sided PCB
2 T with 2 internal planes3
θJA
â
â
3 T Junction to Board LQFP112
θJB
â
â
4 T Junction to Case LQFP112
θJC
â
â
5 T Junction to Package Top LQFP112
ΨJT
â
â
6 T Thermal Resistance QFP 80, single sided PCB
θJA
â
â
7
T
Thermal Resistance QFP 80, double sided PCB with
2 internal planes
θJA
â
â
8 T Junction to Board QFP80
θJB
â
â
9 T Junction to Case QFP80
θJC
â
â
10 T Junction to Package Top QFP80
ΨJT
â
â
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-3
3. PC Board according to EIA/JEDEC Standard 51-7
Max
54
41
31
11
2
51
41
27
14
3
Unit
oC/W
oC/W
oC/W
oC/W
oC/W
oC/W
oC/W
oC/W
oC/W
oC/W
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
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