33702 Datasheet, PDF (5/24 Pages) Motorola, Inc – 3.0 A Switch-Mode Power Supply with Linear Regulator

Freescale Semiconductor, Inc.
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Supply Voltage
V_IN1, V_IN2
-0.3 to 7.0
V
Switching Node
SW
-1.0 to 7.0
V
Buck Regulator Bootstrap Input (BOOT - SW)
BOOT
-0.3 to 8.5
V
Boost Regulator Output
V_BST
-0.3 to 8.5
V
Boost Regulator Drain
V_BD
-0.3 to 9.5
V
RESET Drain Voltage
RESET
-0.3 to 7.0
V
Enable Pins (EN1, EN2)
–
-0.3 to 7.0
V
Logic Pins (SDA, SCL, CLKSYN)
–
-0.3 to 7.0
V
Analog Pins (INV, V_OUT, RESET)
–
-0.3 to 7.0
V
Analog Pins (LDRV_, LFB, LDO, LCMP, CS)
–
-0.3 to 8.5
V
Analog Pins (CLKSEL, ADDR, RT, FREQ, V_DDI)
–
-0.3 to 3.6
V
ESD Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
V_ESD1
V_ESD2
V
±2000
±200
Storage Temperature
T_STG
-65 to 150
°C
Power Dissipation (T_A = 85°C) (Note 3)
P_D
TBD
W
Lead Soldering Temperature (Note 4)
T_SOLDER
260
°C
Maximum Junction Temperature
T_JMAX
125
°C
Thermal Resistance, Junction to Ambient (Note 5)
R_θJA
68
°C/W
Thermal Resistance, Junction to Base (Note 6)
R_θJB
18
°C/W
OPERATING CONDITIONS
Supply Voltage (V_IN1, V_IN2)
V_IN1, V_IN2
2.8 to 6.0
V
Operational Package Temperature (Ambient Temperature)
T_A
-40 to 85
°C
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (C_ZAP=100 pF, R_ZAP=1500 Ω).
2. ESD2 testing is performed in accordance with the Machine Model (C_ZAP=200 pF, R_ZAP=0 Ω).
3. Maximum power dissipation at indicated junction temperature.
4. Lead soldering temperature limit is for 10 seconds maximum duration. Contact Motorola Sales Office for device immersion soldering time/
temperature limits.
5. Thermal resistance measured in accordance with EIA/JESD51-2.
6. Theoretical thermal resistance from the die junction to the exposed pins.
MOTOROLA ANALOG INTEGRATED CI_FRC_oU_rIT_MD_oE_rV_eICE_InD_fA_oT_rA_{mation On This Product,}
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33702
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