33702 Datasheet, PDF (23/24 Pages) Motorola, Inc – 3.0 A Switch-Mode Power Supply with Linear Regulator

Freescale Semiconductor, Inc.
10.3
7.6
7.4
1
PIN 1 ID
B
B
16
5.15
2X 16 TIPS
0.3 A B C
A
A
PACKAGE DIMENSIONS
DWB SUFFIX
32-LEAD SOIC WIDE BODY
PLASTIC PACKAGE
CASE 1324-02
ISSUE A
C
B
59
32
4
11.1
9 ^10.9
2.65
2.35
30X
0.65
CL
17
A
SEATING
PLANE
32X
0.10 A
(0.29)
BASE METAL
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. DATUMS B AND C TO BE DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURRS. MOLD FLASH,
PROTRUSION OR GATE BURRS SHALL NOT EXCEED
0.15 MM PER SIDE. THIS DIMENSION IS DETERMINED
AT THE PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSIONS. INTERLEAD FLASH AND
PROTRUSIONS SHALL NOT EXCEED 0.25 MM PER
SIDE. THIS DIMENSION IS DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.4
MM PER SIDE. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSION AND ADJACENT LEAD
SHALL NOT LESS THAN 0.07 MM.
7. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8. THESE DIMENSIONS APPLY TO THE FLAT SECTION
OF THE LEAD BETWEEN 0.10 MM AND 0.3 MM FROM
THE LEAD TIP.
9. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE
BAR BURRS, GATE BURRS AND INTER-LEAD FLASH,
BUT INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
0.25
0.19
(0.203)
0.38
6 _0.22
PLATING
0.13 M C A M B ₈
SECTION A-A
ROTATED 90 _° CLOCKWISE
R0.08 MIN
0.25
0°
GAUGE PLANE
MIN
8°
0°
0.9
0.5
SECTION B-B
0.29
0.13
MOTOROLA ANALOG INTEGRATED CI_FRC_oU_rIT_MD_oE_rV_eICE_InD_fA_oT_rA_{mation On This Product,}
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33702
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