ARF467FL Datasheet, PDF (4/4 Pages) Microsemi Corporation – RF POWER MOSFETs N-CHANNEL ENHANCEMENT MODE

R1
Bias
0-12V
C6 ^R3
R2
RF
Input _C2
L1
R4
C3 _C1
TL1 _R5
L4
+
C7
C8
- ^150V
L3
RF
C9
Output
L2
ARF467FL
C5
C4
ARF467FL
40.68 MHz Test Circuit
C1 -- 2200pF ATC 700B
C2-C5 -- Arco 465 Mica trimmer
C6-C8 -- .1 µF 500V ceramic chip
C9 -- 3x 2200pF 500V chips COG
L1 -- 3t #22 AWG .25"ID .25 "L ~55nH
L2 -- 5t #16 AWG .312" ID .35"L ~176nH
L3 -- 10t #24 AWG .25"ID ~.5uH
L4 -- VK200-4B ferrite choke 3uH
R1- R3 -- 1kΩ 0.5W
R4- R5 -- 1Ω 1W SMT
TL1 -- 40Ω t-line 0.15 x 2"
C1 is ~1.75" from R4-5.
T3 Package Outline
.125R ^S
4 pls
S
.210
D
S
ARF467FL
1.250
G
S
.330
.210
.325 +/- .01
.125dia
4 pls
.320 _.570
1.500
.300
.005
.200
.040
Thermal Considerations and Package Mounting:
The rated power dissipation is only available when the
package mounting surface is at 25 C and the junction tem-
perature is 175 C. The thermal resistance between junc-
tions and case mounting surface is 0.3 C/W. When instal-
led, an additional thermal impedance of 0.17 C/W between
the package base and the mounting surface is typical. In-
sure that the mounting surface is smooth and flat. Thermal
joint compound must be used to reduce the effects of small
surface irregularities. Use the minimum amount necessary
to coat the surface. The heatsink should incorporate a cop-
per heat spreader to obtain best results.
The package design clamps the ceramic base to the
heatsink. A clamped joint maintains the required mounting
pressure while allowing for thermal expansion of both the
base and the heat sink. Four 4-40 (M3) screws provide
the required mounting force. Torque the mounting screws
to 6 in-lb (0.68 N-m).
HAZARDOUS MATERIAL WARNING
The white ceramic portion of the device between leads and mounting surface is beryllium oxide, BeO. Beryllium oxide dust is toxic when inhaled. Care must be taken during
handling and mounting to avoid damage to this area. These devices must never be thrown away with general industrial or domestic waste.
Microsemi’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786
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