APT5014BLLG Datasheet, PDF (21/44 Pages) Microsemi Corporation – Power Semiconductors Power Modules RF Power MOSFETs

Power Module Part Numbering System
IGBT Modules
APT GL 475 A 120 T D3 G
I II III IV V VI VII VIII
I Trade Mark
IGBT Type:
GF = NPT or NPT FAST
GFQ = NPT ULTRA FAST
II GL = TRENCH 4
GT = TRENCH 3
GV = Mix NPT/TRENCH
CV = Mix TRENCH/CoolMOS
III
Current:
Ic @ Tc=80°C
Topology:
A = Phase Leg
BB = Boost Buck
DA = Boost Chopper
DDA = Double Boost Chopper
DH = Asymmetrical Bridge
DSK = Double Buck Chopper
DU = Dual Common Source
IV
H = Full Bridge
HR = T-Type 3-Level
SDA = Double Boost + Bypass Diode
SK = Buck Chopper
TA = Triple Phase Leg
TDU = Triple Dual Common Source
TL = Three Level
U = Single Switch
VDA = Interleaved PFC
X = Three Phase Bridge
Blocking Voltage:
60 = 600V
V _{120 = 1200V}
170 = 1700V
Option:
A = AIN Substrate
C = SiC Diode
VI _{D = Series Diode}
T = Temperature Sensor
W = Clamping Parallel Diode
Package:
1 = SP1
2 = SP2
3 = SP3
VII _{P = SP6-P}
D1 = D1 (34mm)
D3 = D3 (62mm)
D4 = D4 (62mm)
VIII ^{G = RoHS Compliant}
MOSFET Modules
APT C 60 DA M24 T 1 G
I II III IV V VI VII VIII
I Trade Mark
MOSFET Type:
MC = MOSFET SiC
II _{M = MOSFET}
C = CoolMOS
Blocking Voltage:
08 = 75V
III
10 = 100V
20 = 200V
50 = 500V
60 = 600V
80 = 800V
90 = 900V
100 = 100V
120 = 120V
Topology:
A = Phase Leg
BB = Boost Buck
DA = Boost Chopper
DDA = Double Boost Chopper
DH = Asymmetrical Bridge
DSK = Double Buck Chopper
DU = Dual Common Source
IV ^{H = Full Bridge}
HR = T-Type 3-Level
SDA = Double Boost + Bypass Diode
SK = Buck Chopper
TA = Triple Phase Leg
TDU = Triple Dual Common Source
TL = Three Level NPC
U = Single Switch
VDA = Interleaved PFC
RDSON @ Tc=25°C
240 PƟ
V _{24 PƟ}
M24 PƟ
Option:
A = AlN Substrate
C = SiC Diode
VI
D = Series Diode
F = FREDFET
S = Series and Parallel Diodes
T = Temperature Sensor
U = Ultrafast FREDFET
Package:
1 = SP1
VII 2 = SP2
3 = SP3
P = SP6-P
VIII G = RoHS Compliant
Diode Modules
APT DR 90 X 160 1 G
I II III IV V VI VII
I Trade Mark
Diode Type:
DF = FRED
II ^{DR 6WDQGDUG5HFWLÀHU}
DC = SiC
DSK = Schottky
Current:
III _{IF @ Tc=80°C}
Topology:
AA = Dual Common Anode
BB = Boost Buck
AK = Dual Series
IV _{KK = Dual Common Cathode}
H = Single Phase Bridge
U = Single Switch
X = Three Phase Bridge
Blocking Voltage:
20 = 200V
40 = 400V
V 60 = 600V
100 = 1000V
120 = 1200V
160 = 1600V
170 = 1700V
Package:
VI 1 = SP1
3 = SP3
VII G = RoHS Compliant
Optional Materials
Optional materials are available upon demand on most of the
listed standard power modules. Options are indicated with a
letter in the suffix of the module part number. Temperature
Sensor Option is indicated in the catalog with "YES" or
"option" when available on standard part or on demand.
A _{AIN Substrate for higher thermal conductivity}
M _{AlSiC Base plate material for improved temperature cycling capabilities}
T _{Temperature Sensor (NTC or PTC) for Case Temperature information}
C _{SiC Diode for higher efficiency}
N _{Si3N4 Substrate}
E _{Press fit terminals (for SP3 package only)}
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