APT5014BLLG Datasheet, PDF (19/44 Pages) Microsemi Corporation – Power Semiconductors Power Modules RF Power MOSFETs

Custom Power Modules
Microsemi PMP has created the Application Specific Power Module (ASPM) concept and has been offering customized power modules since 1983. Microsemi PMP offers a
complete engineered solution with mix and match capabilities in term of package, configuration, performance and cost.
Internal Printed Circuit Board
Not available in all modules.
Used to route gate signals tracks to small
signal terminals
Used to mount gate circuit and protection in
case of intelligent power module
Terminals
Screw on or Solder pins
Provides the user with power and signal
connections with minimum parasitic
resistance and inductance
Substrates
Al2O3, AlN, Si3N4
Provide isolation and good heat
transfer to the base plate
Package
Standard or Custom
Ensure environmental protection and
mechanical robustness
Power Semiconductor Die
IGBT, Mosfet, Diode, SiC, Thyristor,
Switching devices soldered to the
substrates and connected by ultrasonic
Al wire bonds
Base Plate
Improve the heat transfer to the heat sink
Copper for good thermal transfer
AlSiC, CuW, CuMoCu for improved
reliability
Change Options:
Elect./thermal performance
Elect./thermal performance
+ electrical configuration
Elect./thermal performance
+ electrical configuration
+ module housing
3 levels of customization are proposed offering different cost and low volume entry:
Die
Die P/N
Substrate
Material
Base plate
Material
Plastic lid
-
Terminals
-
Die P/N
Material & Layout
Material
-
-
Die P/N
Material & Layout Material & Shape Material & Shape
Shape
NRE level
None to low
Low to medium
Medium to high
MOQ
5 to 10
pieces
Microsemi PMP power modules are made of different sub-elements. Most of them are standard and can be re-used to build infinite solutions for the end user.
Microsemi PMP offers optimum development cost and cycle time thanks to long term experience and wide range of available technologies.
Power Modules Features
High Power Density
Isolated and highly thermally conductive substrate
Internal wiring
Minimum parasitics
Minimum output terminals
Mix & match components
Full engineered solutions
Customer Benefits
Size and cost reduction
Excellent thermal management
Reduced external hardware
Improved performance
Reduced assembly time
Optimizes losses
Easy upgrade/less parts counts/short time to market/IP protection
FLEXIBILITY
Great level of integration
Mix of Silicon within the same package
No quantity limitation
TECHNOLOGY
Application oriented
PACKAGING CAPABILITY
Standard and custom packages
Standard and custom terminals
Various substrate technologies
RELIABILITY
Coefficient of thermal expansion matching
APPLICATIONS
Solar - Welding - Plasma Cutting - Semicap - MRI & Xray - EV/HEV - Induction Heating - UPS - Motor control - Data Communication
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