PD671XXX-8 Datasheet, PDF (13/14 Pages) Microsemi Corporation – 24-Channel PoE AF and AT DIMM

PD671xxx - 8 / 12 / 24-Channel PoE AF and AT DIMM
Data Sheet (Non-confidential)
Power Dissipation______________________________________
The PD671xxx power dissipation is concentrated within a few components distributed along the board as
follows. These power dissipation calculations are based on a 24 port DIMM supplied by a 48 VDC power
supply and located at ambient temperature of 70° C.
COMPONENT
DESCRIPTION
Rs
Senses resistor
Mosfet
PoE switching Mosfet
PD69012
PoE manager
PD69000
PoE controller
Total
* Enhanced mode Master board only
UNITS
24
24
2
1*
POWER DISSIPATION [W]
IEEE802.3AF IEEE802.3AT IEEE802.3AT
0.35A/PORT 0.6A/PORT 0.65A/PORT
1.43
4.21
4.94
0.56
1.64
1.93
1.15
1.15
1.15
0.02
0.02
0.02
3.16
7.02
8.04
Important: When deploying an application utilizing the AC disconnect method, carefully select the diode type
and diode location on the mother board. The diode should be located away from the DIMM to prevent mutual
heating and the ventilation should be doubled to deal with higher power dissipation.
AC disconnect diodes power dissipation is based on 1 VDC forward voltage.
COMPONENT
DESCRIPTION
Diode
AC disconnect diode
UNITS
24
POWER DISSIPATION [W]
IEEE802.3AF IEEE802.3AT IEEE802.3AT
0.35A/PORT 0.6A/PORT 0.65A/PORT
8.4
14.4
15.6
Physical Information ___________________________________
Figure 11 shows the PD671xxx DIMM mechanical outline, which can be used in printed circuit layout design.
PD671xxx DIMMs are designed to be mounted onto a 168-contact DIMM connector, capable of accepting
JEDEC MO-161 modules. All units are in millimeters.
Figure 11: DIMM Dimensions
Figure 12: Mechanical Outline of the PD671xxx DIMM
Copyright © 2009
Microsemi
Page 12
Rev. 1.0 / 17-March-10
Analog Mixed Signal Group
2381 Morse Avenue, Irvine, CA 92614, USA; Within the USA: [phone], Outside the USA: [phone] Fax: [phone]