N2M400FDB311A3CE Datasheet, PDF (7/19 Pages) Micron Technology – e·MMC™ Memory

Package Dimensions
Micron Confidential and Proprietary
Preliminary
4GB, 8GB, 16GB, 32GB: e·MMC
Package Dimensions
Figure 4: 100-Ball LBGA – 14.0mm x 18.00mm x 1.4mm (Package Code 1A3)
Seating
plane
0.12 A ^A
1.01 ±0.1
100X Ø0.45
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.4 SMD
ball pads.
10
9
8
7
6
5
4
3
2
1
Ball A1 ID
A
B
Ball A1 ID
16
CTR _{1 TYP}
D
E
F
G
H
J 18 ±0.1
K
L
M
N
P
T
U
1 TYP
9 CTR
14 ±0.1
1.4 MAX
0.25 MIN
Test pads.
Ni/Au plated.
No solder balls.
Note: 1. Dimensions are in millimeters.
PDF: 09005aef84a4d6f1
emmc_4gb_8gb_16gb_32gb_100b-it.pdf - Rev. C 7/12 EN
7
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