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N2M400FDB311A3CE Datasheet, PDF (17/19 Pages) Micron Technology – e·MMC™ Memory
Micron Confidential and Proprietary
Preliminary
4GB, 8GB, 16GB, 32GB: e·MMC
DC Electrical Specifications – Device Power
DC Electrical Specifications – Device Power
The device current consumption for various device configurations is defined in the
power class fields of the ECSD register.
VCC is used for the NAND Flash device and its interface voltage; VCCQ is used for the
controller and the e·MMC interface voltage. A CREG capacitor must be connected to the
VDDI terminal to stabilize regulator output on the system.
Figure 6: Device Power Diagram
VCC
VCCQ
VDDI
CREG
CLK
CMD
DAT[7:0]
Core regulator
Core
logic block
MMC controller
NAND
control signals
NAND Flash
NAND
data bus
Note: Stresses greater than those listed under "Absolute Maximum Ratings" may cause
permanent damage to the device. This is a stress rating only, and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not guaranteed. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
Table 7: Absolute Maximum Ratings
Parameters
Voltage input
VCC supply
VCCQ supply
Storage temperature
Note:
Symbol
Min
VIN
VCC
VCCQ
TSTG
–0.6
–0.6
–0.6
–40
1. Voltage on any pin relative to VSS.
Max
4.6
4.6
4.6
85
Unit
V
V
V
°C
PDF: 09005aef84a4d6f1
emmc_4gb_8gb_16gb_32gb_100b-it.pdf - Rev. C 7/12 EN
17
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