MT40A2G4PM-083E Datasheet, PDF (29/373 Pages) Micron Technology – Programmable data strobe preambles

Figure 8: 78-Ball FBGA – x4, x8 (WE)
0.155
1.8 CTR
nonconductive
overmold
8Gb: x4, x8, x16 DDR4 SDRAM
Package Dimensions
Seating plane
A
0.12 A
78X Ø0.47
Dimensions apply
to solder balls post-
reflow on Ø0.42 SMD
ball pads.
987
12 ±0.1
9.6 CTR
0.8 TYP
321
A
B
C
D
E
F
G
H
J
K
L
M
N
Ball A1 ID
(covered by SR)
0.8 TYP
1.1 ±0.1
6.4 CTR
0.34 ±0.05
8 ±0.1
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC302 (96.8% Sn, 3% Ag, 0.2% Cu).
Ball A1 ID
09005aef861d1d4a
8gb_ddr4_dram.pdf - Rev. G 1/17 EN
29
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