MT47H128M16RT-25EITC Datasheet, PDF (20/134 Pages) Micron Technology – DDR2 SDRAM MT47H512M4 – 64 Meg x 4 x 8 banks MT47H256M8 – 32 Meg x 8 x 8 banks MT47H128M16 – 16 Meg x 16 x 8 banks

2Gb: x4, x8, x16 DDR2 SDRAM
Packaging
Figure 10: 60-Ball FBGA Package (11.5mm x 14mm) – x4, x8
Seating
plane
0.12 A ^A
60X Ø0.45
Solder ball
material: SAC305.
Dimensions
apply to solder
balls post-reflow
on Ø0.33 NSMD
ball pads.
987
8 CTR
0.8 TYP
0.8 ±0.1
321
Ball A1 ID
A
B
C
D
E
F 14 ±0.15
G
H
J
K
L
Ball A1 ID
0.8 TYP
6.4 CTR
11.5 ±0.15
1.2 MAX
0.25 MIN
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN
20
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