MT46V32M16P-6TF Datasheet, PDF (13/93 Pages) Micron Technology – 512Mb: x4, x8, x16 Double Data Rate SDRAM Features

Figure 9:
60-Ball FBGA (10mm x 12.5mm)
0.85 ±0.05
SEATING PLANE
0.10 C
C
60X Ø.45
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS Ø 0.40.
BALL A9
6.40
0.80 (TYP)
1.80
CTR
11.00
5.50 ±0.05
BALL A1
BALL A1 ID
1.00
TYP
6.25 ±0.05
CL
12.50 ±0.10
512Mb: x4, x8, x16 DDR SDRAM
Package Dimensions
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø .33
NON SOLDER MASK DEFINED
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
BALL #1 ID
CL
3.20 ±0.05 5.00 ±0.05
10.00 ±0.10
1.20 MAX
Notes: 1. All dimensions are in millimeters.
2. Topside part marking decoder can be found on Micron’s Web site.
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
512Mb_DDR_x4x8x16_D2.fm - 512Mb DDR: Rev. Q; Core DDR Rev. E 7/11 EN
13
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