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MT29F8G08DAAWCA Datasheet, PDF (1/81 Pages) Micron Technology – 4Gb, 8Gb, and 16Gb x8 NAND Flash Memory | |||
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4Gb, 8Gb, and 16Gb x8 NAND Flash Memory
Features
NAND Flash Memory
MT29F4G08AAA, MT29F8G08BAA, MT29F8G08DAA, MT29F16G08FAA
Features
⢠Single-level cell (SLC) technology
⢠Organization
â Page size x8: 2,112 bytes (2,048 + 64 bytes)
â Block size: 64 pages (128K + 4K bytes)
â Plane size: 2,048 blocks
â Device size: 4Gb: 4,096 blocks; 8Gb: 8,192 blocks;
16Gb: 16,384 blocks
⢠READ performance
â Random READ: 25µs (MAX)
â Sequential READ: 25ns (MIN)
⢠WRITE performance
â PROGRAM PAGE: 220µs (TYP)
â BLOCK ERASE: 1.5ms (TYP)
⢠Data retention: 10 years
⢠Endurance: 100,000 PROGRAM/ERASE cycles
⢠First block (block address 00h) guaranteed to be
valid up to 1,000 PROGRAM/ERASE cycles1
⢠Industry-standard basic NAND Flash command set
⢠Advanced command set:
â PROGRAM PAGE CACHE MODE
â PAGE READ CACHE MODE
â One-time programmable (OTP) commands
â Two-plane commands
â Interleaved die operations
â READ UNIQUE ID (contact factory)
â READ ID2 (contact factory)
⢠Operation status byte provides a software method of
detecting:
â Operation completion
â Pass/fail condition
â Write-protect status
⢠Ready/busy# (R/B#) signal provides a hardware
method of detecting operation completion
⢠WP# signal: write protect entire device
⢠RESET required after power-up
⢠INTERNAL DATA MOVE operations supported
within the plane from which data is read
Figure 1: 48-Pin TSOP Type 1
Options
⢠Density2
â 4Gb (single die)
â 8Gb (dual-die stack 1 CE#)
â 8Gb (dual-die stack 2 CE#)
â 16Gb (quad-die stack)
⢠Device width: x8
⢠Configuration
# of die # of CE# # of R/B# I/O
1
1
1
Common
2
1
1
Common
2
2
2
Common
4
2
2
Common
⢠VCC: 2.7â3.6V
⢠Package
â 48 TSOP type I (lead-free plating)
â 48 TSOP type I OCPL3 (lead-free plating)
⢠Operating temperature
â Commercial (0°C to +70°C)
â Extended (â40°C to +85°C)4
Notes: 1. For further details, see âError Managementâ
on page 58.
2. For part numbering and markings, see
Figure 2 on page 2.
3. OCPL = off-center parting line.
4. For ET devices, contact factory.
PDF: 09005aef81b80e13/Source: 09005aef81b80eac
4gb_nand_m40a__1.fm - Rev. B 2/07 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2006 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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