MIC45116 Datasheet, PDF (7/42 Pages) Microchip Technology – 20V/6A DC/DC Power Module

MIC45116
TEMPERATURE SPECIFICATIONS
Parameters
Sym. Min. Typ.
Max. Units
Conditions
Temperature Ranges
Junction Temperature Range
Maximum Junction Temperature
T_J
–40
—
—
—
—
+125
+150
°C Note 1
°C —
Storage Temperature Range
Lead Temperature
T_S
–65
—
—
—
—
+150
+260
°C —
°C Soldering, 10s
Package Thermal Resistances
52-pin 8 mm x 8 mm x 3 mm QFN
_JA
—
22
—
°C/W Note 2
52-pin 8 mm x 8 mm x 3 mm QFN
_JC
—
5
—
°C/W Note 2
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T_A, T_J, _JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2: _JA and _JC were measured using the MIC45116 evaluation board.
 2016 Microchip Technology Inc.
DS20005571A-page 7