MIC45116 Datasheet, PDF (29/42 Pages) Microchip Technology – 20V/6A DC/DC Power Module

7.2 Solder Paste Stencil Design
(Recommended Stencil Thickness
= 112.5 ±12.5 µm)
The solder stencil aperture openings should be smaller
than the periphery or large PCB exposed pads to
reduce any chance of build-up of excess solder at the
large exposed pad area which can result to solder
bridging.
The suggested reduction of the stencil aperture
opening is typically 0.20 mm smaller than exposed
metal trace.
Please note that a critical requirement is to not
duplicate land pattern of the exposed metal trace as
solder stencil opening because the design and
dimension values are different.
Cyan-colored shaded pad areas indicate exposed
trace keep-out area in Figure 7-2 and Figure 7-3.
MIC45116
FIGURE 7-3:
Stack-Up of Pad Layout and
Solder Paste Stencil.
FIGURE 7-2:
Solder Stencil Opening.
 2016 Microchip Technology Inc.
DS20005571A-page 29