TC1307 Datasheet, PDF (4/28 Pages) Microchip Technology – Four-Channel CMOS LDO with Select Mode, Shutdown and Independent Reset

TC1307
Unless otherwise specified, all limits are established for V_IN = V_R+1, I_L = 100 µA, C_L = 3.3 µF, SHDN > V_IH, T_A = 25°C.
Boldface type specifications apply for junction temperatures, T_J (Note 9) of -40°C to +125°C.
Parameter
Sym
Min
Typ
Max
Units
Conditions
Reset Threshold Voltage
V_TH
2.59 2.63
2.66
V T_A = +25°C
2.55
—
2.70
V T_A = -40°C to +125°C
See Figure 4-2
Reset Circuit Supply Current
Reset Threshold Voltage
Temperature Coefficient
I_VDET
V_TH-TEMP
—
20
—
30
40
µA RESET = Open
—
ppm/°C
Detect Threshold to RESET
Active Time Delay
T_VDET-RESET
—
135
—
µsec V_DET = V_TH to V_TH - 100 mV,
See Figure 4-2
Reset Time-out Period
RESET Output Voltage Low
T_RESET
V_OL-RES
140
300
560
msec See Figure 4-2
—
—
0.3
—
—
0.4
—
—
0.3
V
V_DET = V_TH-min
I_SINK = 1.2 mA
V_DET = V_TH-min
I_SINK = 3.2 mA
V_DET > 1.0V I_SINK = 50 µA
Note 8, See Figure 4-2
RESET Output Voltage High
V_OH-RES
0.8*V_DET —
—
V_DET-
1.5V
V
I_SOURCE = 500 µA
Isource = 800 µA
V_DET>V_TH-max (Both cases),
See Figure 4-2
Temperature Ranges:
Maximum Junction Temperature
T_J
Range
-40
—
+150
°C
Maximum Junction Temperature
T_J
Range
-40
—
+125
°C
Storage Temperature Range
T_A
Thermal Package Resistances:
-65
—
+150
°C
Thermal Resistance, 16L-QSOP
θ_JA
—
112.4
—
°C/W EIA/JEDEC JESD51-751-7
4 Layer Board
Note 1: The minimum V_IN must meet two conditions: V_IN ≥ 2.7V and V_IN ≥ (V_R + 2.5%) + V_DROPOUT.
2: V_R is the nominal regulator output voltage. For example: V_R = 1.8V, 2.5V, 2.8V or 3.0V.
3: TCV_OUT = (V_OUT-HIGH - V_OUT-LOW) * 10⁶ / (V_R * ∆Temperature), V_OUT-HIGH = Highest voltage measured over the tempera-
ture range. V_OUT-LOW = Lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is
tested over a load range from 1mA to the maximum specified output current. Changes in output voltage due to heating
effects are determined using thermal regulation specification TCV_OUT.
5: Thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied.
Specifications are for a current pulse equal to I_LMAX at V_IN = 6.0V for t = 10 msec.
6: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
with a 1V differential applied.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temper-
ature and the thermal resistance from junction to air. (i.e. T_A, T_J, θ_JA). Exceeding the maximum allowable power dissipa-
tion will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction
temperatures above 150°C can impact the device reliability.
8: V_TH-MIN = 2.55V and V_TH-MAX = 2.70V.
9: The Junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the Ambi-
ent temperature is not significant.
DS21702A-page 4
 2002 Microchip Technology Inc.