TC2014 Datasheet, PDF (3/18 Pages) Microchip Technology – 50 mA, 100 mA, 150 mA CMOS LDOs with Shutdown and Reference Bypass

TC2014/2015/2185
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, V_IN = V_R + 1V, I_L = 100 µA, C_OUT = 3.3 µF, SHDN > V_IH, T_A = +25°C.
BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Power Supply
Rejection Ratio
PSRR
—
55
—
dB F ≤ 1 kHz, Cbypass=0.01 µF
Output Short Circuit
I_OUTSC
—
160
300
mA V_OUT = 0V
Current
Thermal Regulation
∆V_OUT/∆P_D
—
Output Noise
eN
—
0.04
200
—
V/W Note 6, Note 7
—
nV/√Hz I_L = I_OUTMAX, F = 10 kHz
470 pF from Bypass to GND
Response Time,
T_R
(Note 8)
(from Shutdown Mode)
—
60
—
µsec V_IN = 4V, I_L = 30 mA,
C_IN = 1 µF, C_OUT = 10 µF
SHDN Input
SHDN Input High
Threshold
V_IH
60
—
—
%V_IN V_IN = 2.5V to 6.0V
SHDN Input Low
Threshold
V_IL
—
—
15
%V_IN V_IN = 2.5V to 6.0V
Note 1: The minimum V_IN has to meet two conditions: V_IN = 2.7V and V_IN = V_R + V_DROPOUT.
2: V_R is the regulator output voltage setting. For example: V_R = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
3:
T C V_{O U T}
=
-⁽--^V----^O---^U----^T---^M----^A---^X----–-----^V----^O---^U----^T---^M----^I--^N---⁾----^×-----¹---⁰---–---⁶-
V_OUT × ∆T
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value at a V differential.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to I_MAX at V_IN = 6V for T = 10 msec.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-
perature and the thermal resistance from junction-to-air (i.e. T_A, T_J, θ_JA).
8: Time required for V_OUT to reach 95% of V_R (output voltage setting), after V_SHDN is switched from 0 to V_IN.
 2003 Microchip Technology Inc.
DS21662C-page 3