93AA76A_06 Datasheet, PDF (20/28 Pages) Microchip Technology – 8K Microwire Compatible Serial EEPROM

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
NOTE 1
12
TOP VIEW
e
b
N
L
K
E
E2
EXPOSED PAD
21
D2
BOTTOM VIEW
NOTE 1
A
A3
A1
NOTE 2
Units
Dimension Limits
Number of Pins
N
Pitch
e
Overall Height
A
Standoff
A1
Contact Thickness
A3
Overall Length
D
Overall Width
E
Exposed Pad Length
D2
Exposed Pad Width
E2
Contact Width
b
Contact Length §
L
Contact-to-Exposed Pad §
K
MILLIMETERS
MIN
NOM
8
0.50 BSC
0.80
0.90
0.00
0.02
0.20 REF
2.00 BSC
3.00 BSC
1.30
—
1.50
—
0.18
0.25
0.30
0.40
0.20
—
MAX
1.00
0.05
1.75
1.90
0.30
0.50
—
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. § Significant Characteristic
4. Package is saw singulated
5. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–123, Sept. 8, 2006
DS21796H-page 20
© 2006 Microchip Technology Inc.