93AA76A_06 Datasheet, PDF (15/28 Pages) Microchip Technology – 8K Microwire Compatible Serial EEPROM

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
12
e
b
c
A
A2
ϕ
A1
L1
L
Units
Dimension Limits
Number of Pins
N
Pitch
e
Overall Height
A
Molded Package Thickness A2
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
Footprint
L1
Foot Angle
ϕ
Lead Thickness
c
Lead Width
b
MIN
—
0.75
0.00
0.40
0°
0.08
0.22
MILLIMETERS
NOM
8
0.65 BSC
—
0.85
—
4.90 BSC
3.00 BSC
3.00 BSC
0.60
0.95 REF
—
—
—
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–111, Sept. 8, 2006
© 2006 Microchip Technology Inc.
DS21796H-page 15