93AA76A_06 Datasheet, PDF (16/28 Pages) Microchip Technology – 8K Microwire Compatible Serial EEPROM

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
6-Lead Plastic Small Outline Transistor (OT) (SOT-23)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
B
n
p1 _D
1
α
c
φ
A
A2
β
L
A1
Units
INCHES*
MILLIMETERS
Dimension Limits
Number of Pins
n
Pitch
p
Outside lead pitch
p1
MIN
NOM
6
.038 BSC
.075 BSC
MAX
MIN
NOM
6
0.95 BSC
1.90 BSC
MAX
Overall Height
A
.035
.046
.057
0.90
1.18
1.45
Molded Package Thickness
A2
.035
.043
.051
0.90
1.10
1.30
Standoff
A1
.000
.003
.006
0.00
0.08
0.15
Overall Width
E
.102
.110
.118
2.60
2.80
3.00
Molded Package Width
E1
.059
.064
.069
1.50
1.63
1.75
Overall Length
D
.110
.116
.122
2.80
2.95
3.10
Foot Length
Foot Angle
Lead Thickness
L
.014
.018
.022
0.35
0.45
0.55
φ
0
5
10
0
5
10
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
.014
.017
.020
0.35
0.43
0.50
α
0
5
10
0
5
10
β
0
5
10
0
5
10
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEITA (formerly EIAJ) equivalent: SC-74A
Drawing No. C04-120
Revised 09-12-05
DS21796H-page 16
© 2006 Microchip Technology Inc.